Dielectric Filter, Transceiver Device, And Base Station

ABSTRACT

Embodiments of this application relate to the field of filter technologies, and in particular, to a dielectric filter, a transceiver device, and a base station. The dielectric filter includes a dielectric block whose surface is covered with a metal layer, where the dielectric block includes at least two resonant cavities; the dielectric block is provided with a via hole, the via hole is located between two adjacent resonant cavities, and an inner wall of the via hole is covered with a metal layer; and a first partition ring is disposed on the surface of the dielectric block and is surrounding at least one opening of the via hole, and the dielectric block is exposed in an area enclosed by an inner edge of the first partition ring and an outer edge of the first partition ring.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of International Application No.PCT/CN2017/073789, filed on Feb. 16, 2017, the disclosure of which ishereby incorporated by reference in its entirety.

TECHNICAL FIELD

Embodiments of this application relate to the field of filtertechnologies, and in particular, to a dielectric filter, a transceiverdevice, and a base station.

BACKGROUND

With the development of the filter industry, a small and light filterhas gradually become a trend. A product size can be significantlyreduced by using a dielectric waveguide, and the dielectric waveguidehas advantages such as a high Q value and a small temperature drift.Therefore, using a dielectric waveguide is a very desirable solution offilter miniaturization.

To achieve a band-pass filtering effect, a structure needs to bedesigned on a dielectric filter to implement high-end zero-pointsuppression and low-end zero-point suppression of a passband. A low-endzero-point of the passband of the filter can be generated throughcapacitive coupling, so as to implement low-end zero-point suppressionoutside the passband. However, for the dielectric filter, implementationof capacitive coupling is not as simple as that of inductive coupling,and a special design is required.

In the prior art, a manner of implementing capacitive coupling on adielectric filter is as follows: A blind slot or a blind hole is dug inthe dielectric filter, and capacitive coupling is implemented on thedielectric filter by controlling a depth of the blind slot or the blindhole. In this manner, although capacitive coupling can be implemented onthe dielectric filter, the depth of the blind slot or the blind holeneeds to be precisely controlled. If the depth of the blind slot or theblind hole is controlled inappropriately, inductive coupling is formedthrough the blind slot or the blind hole.

In the foregoing solution, specific difficulty in processing accuracycontrol is brought because the depth of the blind slot or the blind holeneeds to be precisely controlled. Especially, for a miniaturizedhigh-frequency component, the component has a higher precisionrequirement, difficulty in processing a blind slot or a blind hole issharply increased, and even processing of a blind slot or a blind holecannot be implemented.

SUMMARY

Embodiments of this application provide a dielectric filter, atransceiver device, and a base station, so that a structure forimplementing capacitive coupling is simple and processing difficulty ofa dielectric filter can be lowered.

According to a first aspect, an embodiment of this application providesa dielectric filter, including a dielectric block whose surface iscovered with a metal layer, where the dielectric block includes at leasttwo resonant cavities; the dielectric block is provided with a via hole,the via hole is located between two adjacent resonant cavities, and aninner wall of the via hole is covered with a metal layer; and a firstpartition ring is disposed on the surface of the dielectric block and issurrounding at least one opening of the via hole, and the dielectricblock is exposed in an area enclosed by an inner edge of the firstpartition ring and an outer edge of the first partition ring. Capacitivecoupling between resonant cavities is implemented through a combinedstructure of the via hole and a conductive partition layer (that is, thefirst partition ring). Difficulty in processing the via hole and thefirst partition ring on the dielectric block is lower than difficulty inprocessing a blind slot or a blind hole with a specified depth on thedielectric block. It can be learned that a requirement of the dielectricfilter in this embodiment of this application for a processing techniqueis lowered and a problem of precision control during blind slot or blindhole processing is avoided. Especially, for a miniaturizedhigh-frequency filter with a relatively high precision requirement, itcan also achieve relatively high processing precision.

In a possible design, the dielectric block is provided with at least oneslot, the dielectric block is divided into at least three resonantcavities by the at least one slot, and an inner surface of each slot iscovered with the metal layer. The dielectric block is divided into theat least three resonant cavities by the at least one slot. The slot isimplemented simply, has low processing difficulty, and the at leastthree resonant cavities are formed through the at least one slot,thereby facilitating application in an actual filtering scenario.

In a possible design, the inner edge of the first partition ring and anedge of an opening of the via hole are disposed at intervals. Capacitivecoupling strength of the dielectric filter may be adjusted by adjustingthe interval between the inner edge of the first partition ring and theedge of the opening of the via hole, so as to adjust a low-endzero-point position of the dielectric filter.

In a possible design, a center line of the first partition ringcoincides with an axis of the via hole. That the center line of thefirst partition ring coincides with the axis of the via hole meets anengineering design requirement, and further can make the dielectricfilter present a beautiful structure.

In a possible design, the first partition ring is disposed on each oftwo opening sides of the via hole. That the first partition ring isdisposed on each of the two opening sides of the via hole can cause anincrease in capacitive coupling strength of the dielectric filter.

In a possible design, the via hole is a circular via hole. Designing thevia hole into a circle can further reduce processing difficulty of thedielectric filter.

In a possible design, the via hole is a polygonal via hole. Optionally,the polygonal via hole may be various possible polygonal via holes suchas a triangular via hole, a rectangular via hole, a pentagonal via hole,and a hexagonal via hole.

In a possible design, the dielectric block is further provided with asecond partition ring, the dielectric block is exposed between an inneredge and an outer edge of the second partition ring, and the metal layerin an area enclosed by the inner edge of the second partition ringserves as a signal input end or a signal output end. The metal layer inthe area enclosed by the inner edge of the second partition ring servesas the signal input end or the signal output end, with no need tofurther design an extra port on the dielectric filter as the signalinput end or the signal output end. In this case, the signal input endor the signal output end can be implemented simply and ingeniously.

According to a second aspect, an embodiment of this application providesa transceiver device, including the foregoing dielectric filter.

According to a third aspect, an embodiment of this application providesa base station, including the foregoing transceiver device.

According to the dielectric filter, the transceiver device, and the basestation in the embodiments of this application, capacitive couplingbetween resonant cavities is implemented through the combined structureof the via hole and the conductive partition layer. The structure forimplementing capacitive coupling in the dielectric filter is simple andprocessing difficulty is lowered, so as to overcome a technical problemin the prior art that it is hard to precisely control a depth of a blindslot or a blind hole.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic structural diagram of a dielectric filteraccording to an embodiment of this application;

FIG. 2 is a schematic diagram of an equivalent coupling element of tworesonant cavities distributed on two sides of a via hole according to anembodiment of this application;

FIG. 3 is a schematic diagram of a signal input end of a dielectricfilter according to an embodiment of this application;

FIG. 4 is a schematic structural diagram of another dielectric filteraccording to an embodiment of this application;

FIG. 5 is an equivalent schematic diagram of the dielectric filter shownin FIG. 4;

FIG. 6 is an equivalent circuit diagram of the dielectric filter shownin FIG. 4;

FIG. 7 is a schematic diagram of a passband of a dielectric filteraccording to an embodiment of this application;

FIG. 8 is a schematic diagram of a low-end zero-point adjustment curveof a dielectric filter according to an embodiment of this application;

FIG. 9 is a schematic structural diagram of still another dielectricfilter according to an embodiment of this application;

FIG. 10 is an equivalent schematic diagram of the dielectric filtershown in FIG. 9;

FIG. 11 is an equivalent circuit diagram of the dielectric filter shownin FIG. 9;

FIG. 12 is a schematic structural diagram of yet another dielectricfilter according to an embodiment of this application;

FIG. 13 is an equivalent circuit diagram of the dielectric filter shownin FIG. 12; and

FIG. 14 is a schematic structural diagram of a transceiver deviceaccording to an embodiment of this application.

Reference signs: 1—first resonant cavity; 2—second resonant cavity;3—third resonant cavity; 4—first slot; 5—second slot; 6—via hole;7—first partition ring; 7 a—outer edge of the first partition ring; 7b—inner edge of the first partition ring; 8—fourth resonant cavity;9—second partition ring; 10—fifth resonant cavity; 11—sixth resonantcavity; 12—microstrip feeder; 21—antenna; 22—dielectric filter;23—switch; 24—signal transmitting branch; 25—signal receiving branch;241—power amplifier; and 251—low noise amplifier.

DESCRIPTION OF EMBODIMENTS

FIG. 1 is a schematic structural diagram of a dielectric filteraccording to an embodiment of this application. As shown in FIG. 1, thedielectric filter includes a dielectric block whose surface is coveredwith a metal layer, and the dielectric block is made of a soliddielectric material. In FIG. 1, the metal layer covering the surface ofthe dielectric block is not identified. For a structure shown in FIG. 1,except a particularly specified part, each surface of the structureshown in FIG. 1 is covered with the metal layer.

The dielectric block shown in FIG. 1 includes at least two resonantcavities. As shown in FIG. 1, the dielectric block may be provided witha slot, and the dielectric block is divided into the at least tworesonant cavities through the slot. It should be noted that an innersurface of each slot is also covered with the metal layer. For example,in FIG. 1, the dielectric block is divided through two first slots 4into two resonant cavities: a first resonant cavity 1 and a secondresonant cavity 2. The first resonant cavity 1 and the second resonantcavity 2 each are equivalent to a parallel circuit formed by an inductorand a capacitor.

To form capacitive coupling in the dielectric filter shown in FIG. 1, avia hole 6 is further disposed in the dielectric block shown in FIG. 1,and the via hole 6 is located between two adjacent resonant cavities. Asshown in FIG. 1, the via hole 6 is disposed between the first resonantcavity 1 and the second resonant cavity 2, and an inner wall of the viahole 6 is covered with a metal layer. Further, a first partition ring 7is disposed on the surface of the dielectric block and is surrounding atleast one opening of the via hole 6, and the dielectric block is exposedin an area enclosed by an inner edge 7 b of the first partition ring andan outer edge 7 a of the first partition ring. Optionally, a center lineof the first partition ring 7 coincides with an axis of the via hole 6.

In the solution of this embodiment of this application, structuraldiscontinuity is generated because the dielectric filter is providedwith a combined structure of the first partition ring 7 and the via hole6, so that an electric field near the via hole 6 and the first partitionring 7 is more concentrated and electric energy can be stored. As shownin FIG. 2, the combined structure of the first partition ring 7 and thevia hole 6 is equivalent to a capacitor that stores electric energy.

In addition, although structural discontinuity is also generated whenthe dielectric filter is not provided with the combined structure of thefirst partition ring 7 and the via hole 6, near the via hole 6, magneticenergy dominates, and an inductance characteristic is presented.

In the solution of this embodiment of this application, the inner edgeof the first partition ring 7 may coincide with an edge of an opening ofthe via hole 6. Optionally, the inner edge of the first partition ring 7and the edge of the opening of the via hole 6 are disposed at intervals.Capacitive coupling strength of the dielectric filter may be adjusted byadjusting the interval between the inner edge of the first partitionring 7 and the edge of the opening of the via hole 6, so as to adjust alow-end zero-point position of the dielectric filter.

In addition, a shape of the via hole 6 of the dielectric filter in thisembodiment of this application may be designed based on an actualrequirement. For example, the via hole 6 may be designed to be acircular via hole 6 or a polygonal via hole. When the via hole 6 isdesigned to be the circular via hole, a processing operation is easier.When the via hole 6 is designed to be the polygonal via hole, thepolygonal via hole may be, for example, various possible polygonal viaholes such as a triangular via hole, a rectangular via hole, apentagonal via hole, and a hexagonal via hole.

Further, in the dielectric filter shown in FIG. 1, the shape of the viahole 6 may be the same as or different from a shape of the firstpartition ring 7. For example, the via hole 6 is a circular via hole,and the first partition ring 7 is a square ring or a partition ring ofan irregular shape. A specific shape and size of the partition ring maybe adjusted based on a performance requirement of the dielectric filter,and this is not specifically limited.

In the dielectric filter shown in FIG. 1, the first partition ring 7 isdisposed on an opening side of the via hole 6. In an optionalembodiment, the first partition ring 7 may be disposed on each of twoopening sides of the via hole 6.

Further, the dielectric filter in this embodiment of this applicationmay be applied to a transceiver device, for example, may be applied to abase station. To be connected to a circuit structure of the transceiverdevice, the dielectric filter shown in FIG. 1 is further provided with asignal input end and a signal output end.

For example, in the dielectric filter shown in FIG. 1, the signal inputend is disposed on the first resonant cavity 1, and the signal outputend is disposed on the second resonant cavity 2.

FIG. 3 is a schematic structural diagram of the signal input enddisposed on the first resonant cavity 1. Using a structure shown in FIG.3 as an example, a structure of the signal input end is as follows: Asecond partition ring 9 is disposed on the first resonant cavity 1, thedielectric block is exposed between an inner edge and an outer edge ofthe second partition ring 9, and the metal layer in an area enclosed bythe inner edge of the second partition ring 9 serves as the signal inputend.

In the solution of this embodiment of this application, a structure ofthe signal output end may be the same as the structure of the signalinput end, and details are as follows:

A third partition ring is disposed on the second resonant cavity 2, thedielectric block is exposed between an inner edge and an outer edge ofthe third partition ring, and the metal layer in an area enclosed by theinner edge of the third partition ring serves as the signal output end.

FIG. 4 is a schematic structural diagram of another dielectric filteraccording to an embodiment. As shown in FIG. 4, the dielectric filterincludes a dielectric block whose surface is covered with a metal layer,and the dielectric block is made of a solid dielectric material. In FIG.4, the metal layer covering the surface of the dielectric block is notidentified. For a structure shown in FIG. 4, except a particularlyspecified part, each surface of the structure shown in FIG. 4 is coveredwith the metal layer.

As shown in FIG. 4, the dielectric block is provided with a first slot 4and a second slot 5, and inner surfaces of the first slot 4 and thesecond slot 5 are also covered with the metal layer. The dielectricblock is divided into three resonant cavities through the first slot 4and the second slot 5. Specifically, the first slot 4 is used toseparate a first resonant cavity 1 from a third resonant cavity 3, thesecond slot 5 is used to separate the first resonant cavity 1 from asecond resonant cavity 2, and the second slot 5 is further used toseparate the second resonant cavity 2 from the third resonant cavity 3.

In the dielectric filter shown in FIG. 4, each resonant cavity isequivalent to a parallel circuit formed by an inductor and a capacitor.A narrow channel between two adjacent resonant cavities is an openwindow between the resonant cavities, and coupling between the twoadjacent resonant cavities that is formed based on the open window isinductive coupling.

When a signal is input from the first resonant cavity 1 of thedielectric filter shown in FIG. 4 and output from the third resonantcavity 3 of the dielectric filter, two signal paths are formed on thedielectric filter shown in FIG. 4, as shown in FIG. 5, including thefollowing:

a first path (marked by using a solid line): a signal path subsequentlypassing through the first resonant cavity 1, the second resonant cavity2, and the third resonant cavity 3; and

a second path (marked by using a dashed line): a signal pathsubsequently passing through the first resonant cavity 1 and the thirdresonant cavity 3.

The first path is a primary coupling path of the dielectric filter, andinductive coupling is formed between adjacent resonant cavities based onan open window structure. When coupling between the first resonantcavity 1 and the third resonant cavity 3 in the second path is inductivecoupling, after the input signal passes from the first resonant cavity 1to the third resonant cavity 3, phases of two path signals are the same,and no zero-point is generated due to in-phase signal superposition.When coupling between the first resonant cavity 1 and the third resonantcavity 3 in the second path is capacitive coupling, after the inputsignal passes from the first resonant cavity 1 to the third resonantcavity 3, phases of two path signals are opposite to each other, the twopath signals cancel each other, and a zero-point can be generated.

To form capacitive coupling between the first resonant cavity 1 and thethird resonant cavity 3 in the second path, as shown in FIG. 4, a viahole 6 is disposed between the first resonant cavity 1 and the thirdresonant cavity 3, an inner wall of the via hole 6 is covered with ametal layer, a first partition ring 7 is disposed on a surface of thedielectric block and is surrounding at least one opening of the viahole, and the dielectric block is exposed in an area enclosed by aninner edge 7 b of the first partition ring and an outer edge 7 a of thefirst partition ring. Optionally, the inner edge 7 b of the firstpartition ring and an edge of an opening of the via hole 6 are disposedat intervals. Optionally, a center line of the first partition ring 7coincides with an axis of the via hole 6.

Structural discontinuity is generated because the dielectric filter isprovided with a combined structure of the first partition ring 7 and thevia hole 6, so that an electric field near the via hole 6 and the firstpartition ring 7 is more concentrated and electric energy can be stored.In this case, the combined structure of the first partition ring 7 andthe via hole 6 is equivalent to a capacitor that stores electric energy.

As shown in FIG. 6, an equivalent circuit of the dielectric filter shownin FIG. 4 has the following characteristic: Inductive coupling is formedbetween the first resonant cavity 1, the second resonant cavity 2, andthe third resonant cavity 3 in the first path; and capacitive couplingis formed between the first resonant cavity 1 and the third resonantcavity 3 in the second path.

Because phases of two path signals are opposite to each other, and thetwo path signals cancel each other, low-end zero-point suppression of apassband can be generated.

As shown in FIG. 7, the dielectric filter shown in FIG. 4 forms ahigh-end zero-point A of a passband of the filter through inductivecoupling and forms a low-end zero-point B of the passband throughcapacitive coupling.

As shown in FIG. 8, capacitive coupling strength can be adjusted byadjusting a diameter of the via hole 6 and a width of the firstpartition ring 7, so as to adjust a low-end zero-point position of apassband of the dielectric filter. When the diameter of the via hole 6increases, and/or when the width of the first partition ring 7increases, an equivalent capacitance value increases, capacitivecoupling strength increases correspondingly, and the zero-point positionchanges correspondingly. As shown in FIG. 8, a point B1 is a low-endzero-point position in which capacitive coupling strength is relativelyhigh, and B3 is a low-end zero-point position in which capacitivecoupling strength is relatively low. Capacitive coupling strengthbetween two resonant cavities that is corresponding to a low-endzero-point position B2 is higher than the capacitive coupling strengthbetween two resonant cavities that is corresponding to the point B3, andis lower than the capacitive coupling strength between two resonantcavities that is corresponding to the point B1.

Therefore, it can be learned that, in the dielectric filter provided inthis embodiment of this application, capacitive coupling strength may beadjusted by adjusting the diameter of the via hole 6 and the width ofthe first partition ring 7. Therefore, it is relatively easy toimplement strong coupling between resonant cavities.

In addition, a shape of the via hole 6 of the dielectric filter in thisembodiment of this application may be designed based on an actualrequirement. For example, the via hole 6 may be designed to be acircular via hole 6 or a polygonal via hole 6. When the via hole 6 isdesigned to be the circular via hole 6, a processing operation iseasier. When the via hole 6 is designed to be the polygonal via hole 6,the polygonal via hole 6 may be, for example, various possible polygonalvia holes 6 such as a triangular via hole 6, a rectangular via hole 6, apentagonal via hole 6, and a hexagonal via hole 6.

Further, in the dielectric filter shown in FIG. 4, the shape of the viahole 6 may be the same as or different from a shape of the firstpartition ring 7. For example, the via hole 6 is a circular via hole,and the first partition ring 7 is a square ring or a partition ring ofan irregular shape. A specific shape and size of the first partitionring 7 may be adjusted based on a performance requirement of thedielectric filter, and this is not specifically limited.

In the dielectric filter shown in FIG. 4, the first partition ring 7 isdisposed on an opening side of the via hole 6. In an optionalembodiment, the first partition ring 7 may be disposed on each of twoopening sides of the via hole 6.

Further, the dielectric filter in this embodiment of this applicationmay be applied to a transceiver device, for example, may be applied to abase station. To be connected to a circuit structure of the transceiverdevice, the dielectric filter shown in FIG. 4 is further provided with asignal input end and a signal output end.

For example, in the dielectric filter shown in FIG. 4, the signal inputend is disposed on the first resonant cavity 1, and the signal outputend is disposed on the third resonant cavity 3. A manner in which thesignal input end and the signal output end are disposed on thedielectric filter is the same as that in FIG. 3, and details are notdescribed herein again.

FIG. 9 is a schematic structural diagram of still another dielectricfilter according to an embodiment of this application. As shown in FIG.9, the dielectric filter includes a dielectric block whose surface iscovered with a metal layer, and the dielectric block is made of a soliddielectric material. In FIG. 9, the metal layer covering the surface ofthe dielectric block is not identified. For a structure shown in FIG. 9,except a particularly specified part, each surface of the structureshown in FIG. 9 is covered with the metal layer.

As shown in FIG. 9, the dielectric block is provided with two firstslots 4 and one second slot 5, and inner surfaces of the two first slots4 and the second slot 5 are covered with the metal layer. The dielectricblock is divided into four resonant cavities through the two first slots4 and the second slot 5. Specifically, one first slot is used toseparate a first resonant cavity 1 from a fourth resonant cavity 8, theother first slot is used to separate a second resonant cavity 2 from athird resonant cavity 3, and the second slot 5 is used to separate thefirst resonant cavity 1 from the second resonant cavity 2 and furtherseparate the third resonant cavity 3 from the fourth resonant cavity 8.

In the dielectric filter shown in FIG. 9, each resonant cavity isequivalent to a parallel circuit formed by an inductor and a capacitor.A narrow channel between two adjacent resonant cavities is an openwindow between the resonant cavities, and coupling between the twoadjacent resonant cavities that is formed based on the open window isinductive coupling.

When a signal is input from the first resonant cavity 1 of thedielectric filter shown in FIG. 9 and output from the fourth resonantcavity 8 of the dielectric filter, two signal paths are formed on thedielectric filter shown in FIG. 9, as shown in FIG. 10, including thefollowing:

a first path (marked by using a solid line): a signal path subsequentlypassing through the first resonant cavity 1, the second resonant cavity2, the third resonant cavity 3, and the fourth resonant cavity 8; and

a second path (marked by using a dashed line): a signal pathsubsequently passing through the first resonant cavity 1 and the fourthresonant cavity 8.

In the first path, inductive coupling is formed between adjacentresonant cavities based on an open window structure. When couplingbetween the first resonant cavity 1 and the fourth resonant cavity 8 inthe second path is inductive coupling, after the input signal passesfrom the first resonant cavity 1 to the fourth resonant cavity 8, phasesof two path signals are the same, and no zero-point is generated due toin-phase signal superposition. When coupling between the first resonantcavity 1 and the fourth resonant cavity 8 in the second path iscapacitive coupling, after the input signal passes from the firstresonant cavity 1 to the fourth resonant cavity 8, phases of two pathsignals are opposite to each other, the two path signals cancel eachother, and a zero-point can be generated.

To form capacitive coupling between the first resonant cavity 1 and thefourth resonant cavity 8 in the second path, as shown in FIG. 9, a viahole 6 is disposed between the first resonant cavity 1 and the fourthresonant cavity 8, an inner wall of the via hole 6 is covered with ametal layer, a first partition ring 7 is disposed on a surface of thedielectric block and is surrounding at least one opening of the via hole6, and the dielectric block is exposed in an area enclosed by an inneredge 7 b of the first partition ring and an outer edge 7 a of the firstpartition ring. Optionally, the inner edge 7 b of the first partitionring and an edge of the corresponding via hole 6 are disposed atintervals.

In the solution of this embodiment of this application, capacitivecoupling is formed between the first resonant cavity 1 and the fourthresonant cavity 8 through a combined structure of the via hole 6 and thepartition ring. An equivalent circuit is a capacitor element.

As shown in FIG. 11, an equivalent circuit of the dielectric filtershown in FIG. 9 has the following characteristic: Inductive coupling isformed between the first resonant cavity 1, the second resonant cavity2, the third resonant cavity 3, and the fourth resonant cavity 8 in thefirst path; and capacitive coupling is formed between the first resonantcavity 1 and the fourth resonant cavity 8 in the second path. Becausephases of two path signals are opposite to each other, and the two pathsignals cancel each other, low-end zero-point suppression of a passbandcan be generated.

Similarly, in this embodiment, a purpose of adjusting a low-endzero-point position of the dielectric filter may be alternativelyachieved by adjusting a diameter of the via hole 6 and a width of thefirst partition ring 7.

In addition, a shape of the via hole 6 of the dielectric filter in thisembodiment of this application may be designed based on an actualrequirement. For example, the via hole 6 may be designed to be acircular via hole 6 or a polygonal via hole 6. When the via hole 6 isdesigned to be the circular via hole 6, a processing operation iseasier. When the via hole 6 is designed to be the polygonal via hole 6,the polygonal via hole 6 may be, for example, various possible polygonalvia holes 6 such as a triangular via hole 6, a rectangular via hole 6, apentagonal via hole 6, and a hexagonal via hole 6.

In the dielectric filter shown in FIG. 9, the first partition ring 7 isdisposed on an opening side of the via hole 6. In an optionalembodiment, the first partition ring 7 may be disposed on each of twoopening sides of the via hole 6.

Further, the dielectric filter in this embodiment of this applicationmay be applied to a transceiver device, for example, may be applied to abase station. To be connected to a circuit structure of the transceiverdevice, the dielectric filter shown in FIG. 9 is further provided with asignal input end and a signal output end. A manner in which the signalinput end and the signal output end are disposed on the dielectricfilter is the same as that in the foregoing embodiments, and details arenot described herein again.

FIG. 12 is a schematic structural diagram of yet another dielectricfilter according to an embodiment of this application. As shown in FIG.12, the dielectric filter includes a dielectric block whose surface iscovered with a metal layer. In FIG. 12, the metal layer covering thesurface of the dielectric block is not identified. For a structure shownin FIG. 12, except a particularly specified part, each surface of thestructure shown in FIG. 12 is covered with the metal layer. During thefollowing description of the structure in FIG. 12, only a part coveredwith no metal layer is particularly described.

The dielectric block shown in FIG. 12 is provided with slots, and thedielectric block is divided into a plurality of resonant cavitiesthrough the slots. As shown in FIG. 12, the dielectric block is providedwith four first slots 4 and one second slot 5, and the dielectric blockis divided into a first resonant cavity 1, a second resonant cavity 2, athird resonant cavity 3, a fourth resonant cavity 8, a fifth resonantcavity 10, and a sixth resonant cavity 11 through the four first slots 4and the second slot 5.

When a signal is input from the first resonant cavity 1 of thedielectric filter shown in FIG. 12 and output from the sixth resonantcavity 11 of the dielectric filter, two signal paths are formed on thedielectric filter shown in FIG. 12, as shown in FIG. 12, including thefollowing:

a first path (marked by using a solid line): a signal path subsequentlypassing through the first resonant cavity 1, the second resonant cavity2, the third resonant cavity 3, the fourth resonant cavity 8, the fifthresonant cavity 10, and the sixth resonant cavity 11; and

a second path (marked by using a dashed line): a signal pathsubsequently passing through the first resonant cavity 1, the secondresonant cavity 2, the fifth resonant cavity 10, and the sixth resonantcavity 11.

In the first path, inductive coupling is formed between adjacentresonant cavities based on an open window structure. When couplingbetween the second resonant cavity 2 and the fifth resonant cavity 10 inthe second path is inductive coupling, phases of two path signals arethe same, and no zero-point is generated due to in-phase signalsuperposition. When coupling between the second resonant cavity 2 andthe fifth resonant cavity 10 in the second path is capacitive coupling,phases of two path signals are opposite to each other, the two pathsignals cancel each other, and a zero-point can be generated.

To form capacitive coupling between the second resonant cavity 2 and thefifth resonant cavity 10 in the second path, as shown in FIG. 12, a viahole 6 is disposed between the second resonant cavity 2 and the fifthresonant cavity 10, an inner wall of the via hole 6 is covered with ametal layer, a first partition ring 7 is disposed on a surface of thedielectric block and is surrounding at least one opening of the via hole6, and the dielectric block is exposed in an area enclosed by an inneredge of the first partition ring 7 and an outer edge of the firstpartition ring 7. Optionally, the inner edge of the first partition ring7 and an edge of the corresponding via hole 6 are disposed at intervals.

In the solution of this embodiment of this application, capacitivecoupling is formed between the first resonant cavity 1 and the fourthresonant cavity 8 through a combined structure of the via hole 6 and thepartition ring. An equivalent circuit is a capacitor element.

As shown in FIG. 13, an equivalent circuit of the dielectric filtershown in FIG. 12 has the following characteristic: Inductive coupling isformed between the first resonant cavity 1, the second resonant cavity2, the third resonant cavity 3, the fourth resonant cavity 8, the fifthresonant cavity 10, and the sixth resonant cavity 11 in the first path;and capacitive coupling is formed between the second resonant cavity 2and the fifth resonant cavity 10 in the second path. Because phases oftwo path signals are opposite to each other, and the two path signalscancel each other, low-end zero-point suppression of a passband can begenerated.

Similarly, in this embodiment, a purpose of adjusting a low-endzero-point position of the dielectric filter may be alternativelyachieved by adjusting a diameter of the via hole 6 and a width of thefirst partition ring 7.

In addition, a shape of the via hole 6 of the dielectric filter in thisembodiment of this application may be designed based on an actualrequirement. For example, the via hole 6 may be designed to be acircular via hole 6 or a polygonal via hole 6. When the via hole 6 isdesigned to be the circular via hole 6, a processing operation iseasier. When the via hole 6 is designed to be the polygonal via hole 6,the polygonal via hole 6 may be, for example, various possible polygonalvia holes 6 such as a triangular via hole 6, a rectangular via hole 6, apentagonal via hole 6, and a hexagonal via hole 6.

In the dielectric filter shown in FIG. 12, the first partition ring 7 isdisposed on an opening side of the via hole 6. In an optionalembodiment, the first partition ring 7 may be disposed on each of twoopening sides of the via hole 6.

Further, the dielectric filter in this embodiment of this applicationmay be applied to a transceiver device, for example, a duplexer and aradio frequency signal filter. To be connected to a circuit structure ofthe transceiver device, the dielectric filter shown in FIG. 12 isfurther provided with a signal input end and a signal output end. Amanner in which the signal input end and the signal output end aredisposed on the dielectric filter is the same as that in the foregoingembodiments, and details are not described herein again. As shown inFIG. 12, the signal input end and the signal output end on thedielectric filter may be disposed on a circuit board through amicrostrip feeder 12 and connected to other components through themicrostrip feeder 12.

The embodiments of this application further provide a transceiverdevice, and the transceiver device includes any dielectric filterprovided in the embodiments of this application. Optionally, FIG. 14 isa possible structural diagram of a transceiver device. The transceiverdevice includes a dielectric filter 22, an antenna 21, a switch 23, asignal receiving branch 25, and a signal transmitting branch 24; theantenna 21, the dielectric filter 22, and a control end of the switch 23are sequentially connected; and two option ends of the switch 23 areconnected to the signal receiving branch 25 and the signal transmittingbranch 24, respectively. Specifically, a power amplifier 241 may bedisposed on the signal transmitting branch 24, and a low noise amplifier251 may be disposed on the signal receiving branch 25.

The embodiments of this application further provide a base station. Thebase station includes the transceiver device provided in the embodimentsof this application. The base station described in this application mayinclude network-side devices in various forms for wireless communicationwith user equipment, such as a macro base station, a micro base station,a relay station, an access point, or a remote radio unit (remote radiounit, RRU). This is not uniquely limited in this application. In systemsusing different radio access technologies, names of devices having abase station function may be different. For example, in an LTE network,the device is referred to as an evolved NodeB (evolved NodeB, eNB oreNodeB). In a 3G (the 3rd Generation, 3rd Generation) network, thedevice is referred to as a NodeB (NodeB).

The foregoing descriptions are merely specific implementations of thisapplication, but are not intended to limit the protection scope of thisapplication. Any variation or replacement readily figured out by aperson skilled in the art within the technical scope disclosed in thisapplication shall fall within the protection scope of this application.Therefore, the protection scope of this application shall be subject tothe protection scope of the claims.

What is claimed is:
 1. A dielectric filter, comprising a dielectricblock whose surface is covered with a metal layer, wherein thedielectric block comprises at least two resonant cavities; thedielectric block is provided with a via hole, the via hole is locatedbetween two adjacent resonant cavities, and an inner wall of the viahole is covered with a metal layer; and a first partition ring isdisposed on the surface of the dielectric block and is surrounding atleast one opening of the via hole, and the dielectric block is exposedin an area enclosed by an inner edge of the first partition ring and anouter edge of the first partition ring.
 2. The dielectric filteraccording to claim 1, wherein the dielectric block is provided with atleast one slot, the dielectric block is divided into at least threeresonant cavities by the at least one slot, and an inner surface of eachslot is covered with the metal layer.
 3. The dielectric filter accordingto claim 1, wherein the inner edge of the first partition ring and anedge of an opening of the via hole are disposed at intervals.
 4. Thedielectric filter according to claim 1, wherein a center line of thefirst partition ring coincides with an axis of the via hole.
 5. Thedielectric filter according to claim 1, wherein the first partition ringis disposed on each of two opening sides of the via hole.
 6. Thedielectric filter according to claim 1, wherein the via hole is acircular via hole.
 7. The dielectric filter according to claim 1,wherein the via hole is a polygonal via hole.
 8. The dielectric filteraccording to claim 1, wherein the dielectric block is further providedwith a second partition ring; the dielectric block is exposed between aninner edge and an outer edge of the second partition ring; and the metallayer in an area enclosed by the inner edge of the second partition ringserves as a signal input end or a signal output end.
 9. A transceiverdevice, comprising a dielectric filter, wherein the dielectric filtercomprises a dielectric block whose surface is covered with a metallayer, and wherein the dielectric block comprises at least two resonantcavities; the dielectric block is provided with a via hole, the via holeis located between two adjacent resonant cavities, and an inner wall ofthe via hole is covered with a metal layer; and a first partition ringis disposed on the surface of the dielectric block and is surrounding atleast one opening of the via hole, and the dielectric block is exposedin an area enclosed by an inner edge of the first partition ring and anouter edge of the first partition ring.
 10. The transceiver deviceaccording to claim 9, wherein the dielectric block is provided with atleast one slot, the dielectric block is divided into at least threeresonant cavities by the at least one slot, and an inner surface of eachslot is covered with the metal layer.
 11. The transceiver deviceaccording to claim 9, wherein the inner edge of the first partition ringand an edge of an opening of the via hole are disposed at intervals. 12.The transceiver device according to claim 9, wherein a center line ofthe first partition ring coincides with an axis of the via hole.
 13. Thetransceiver device according to claim 9, wherein the first partitionring is disposed on each of two opening sides of the via hole.
 14. Thetransceiver device according to claim 9, wherein the via hole is acircular via hole.
 15. The transceiver device according to claim 9,wherein the via hole is a polygonal via hole.
 16. The transceiver deviceaccording to claim 9, wherein the dielectric block is further providedwith a second partition ring; the dielectric block is exposed between aninner edge and an outer edge of the second partition ring; and the metallayer in an area enclosed by the inner edge of the second partition ringserves as a signal input end or a signal output end.
 17. A base station,comprising the transceiver device according to claim 9.